Inside Intel’s Bold $26 Billion U.S. Plan To Regain Chip Dominance
Intel shared a plan that contributed to the easing of global semiconductor supply by using its Vietnamese manufacturing facilities. Intel’s Vietnam Assembly and Test Factory introduced innovative substrate process techniques to provide additional volume of millions of chips last year. Intel has allowed us to meet our customers’ demand despite the lack of substrates throughout the industry.

Keyvan Esfarjani, chief vice president of Intel and chief global operating officer, said, “The way to use Vietnamese plant is that integrated manufacturing capabilities are the cornerstone of Intel success. Intel’s global factory network and supply chain ecosystem will respond better to the changing environment and provide flexibly. ” It led to sales. Through this, we were able to meet the constantly changing customer requirements. ”

Starting with the initial stage of the fan-decicated computing, the demand for computing has put in the semiconductor industry at the center of an unprecedented supply chain crisis. This supply chain crisis led to the lack of major parts of semiconductors, including the latest processor’s most basic components, the Ajinomoto Build Up Film (ABF) substrate.

The computer chip is assembled between the substrate and the hit spreader and is shipped after a complete processor. These packages protect the chip and electrically connect the processor and circuit board inside the computer. At first glance, the substrate can be seen as a green thin plastic, but it consists of about 10 fiber glass layers complexly connected to metal parts. Substrate and computer chips are electrically connected only in the error range of micron units, and signals can be enlarged and output from the motherboard to the chip through the substrate.

One of the main parts of the substrate is a capacitor, a device that can store charge. The festival reduces noise and impedance and keeps the voltage delivered to the chip constant. Over the years, Intel and Substrate providers have been attaching one side of each substrate and attaching a fabric. Currently, Intel is attaching a capacitor on both sides of the subgstrate at the Vietnam Semiconductor Assembly and Test (VNAT) plant. Since May 2021, VNAT has been supporting efforts such as expanding factory installation space, introducing additional tools, and revising existing tools.

“This effort is the ultimate evidence of why integrated manufacturing capabilities are good for Intel and Intel’s customers,” said Kim Hui, vice president of Intel and Vietnamese site. It can improve the assembly rate by 80% and solve the production capacity problem that substrate providers experience. Intel has been providing the same massive manufacturing process and quality as a substrate provider last year. Intel plans to continue to expand its production capacity to apply these capabilities to more products in the future. ”

For Intel Vietnam: Intel Products Vietnam (IPV) is the largest assembly and test plant in Intel manufacturing network. The IPV, which has more than 2,800 employees and has invested a total of $ 1.5 billion, is the largest US high-tech investment in Vietnam. Since the start of operations 15 years ago, IPV has shipped more than 3 billion products to Intel customers around the world by the end of 2021.